Visit the Embedded World exhibition in Nuremberg in March 1.-3. and meet us at the stand no. 625 in hall 9 to order a sample of the new i.MX51 SODIMM Module for your high-end cost-sensitive multimedia application. This project was supported by the Slovak Research and Development Agency.

The latest Android 2.3 Gingerbread is now available for the i.MX25 SODIMM Module in the MAXimum configuration. Please visit the Voipac Downloads page for the kernel patch and Android page to get the full Android source code.