Voipac - The Embedded Professionals
News archive
2/24/11
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i.MX51 Computer on Module for just 119,- EUR
Visit the Embedded World exhibition in Nuremberg in March 1.-3. and meet us at the stand no. 625 in hall 9 to order a sample of the new i.MX51 SODIMM Module for your high-end cost-sensitive multimedia application. This project was supported by the Slovak Research and Development Agency.
2/4/11
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i.MX25 SODIMM Module running Android Gingerbread 2.3
The latest Android 2.3 Gingerbread is now available for the i.MX25 SODIMM
Module in the MAXimum configuration.
Please visit the Voipac Downloads page for the kernel patch and Android page
to get the full Android source code.
11/29/10
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Invitation to Voipac stand at the Embedded World 2011
10/4/10
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Meet Voipac at MIDEST Paris exhibition in November 2.-5.
Visit the MIDEST exhibition in Paris and meet us at the stand no. 6 W 083 to discuss the new i.MX25 SODIMM Module features with our sales & support representatives. All orders for the new i.MX25 Development kit placed at our stand during the exhibition are subject to a 15% exhibition discount.
10/4/10
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Meet Voipac at VIENNA-TEC exhibition in October 12.-15.
Do not miss the opportunity to visit the VIENNA-TEC, meet us at the stand no. C 0124, and be among the first customers to discuss the new i.MX25 SODIMM Module features with our sales & support representatives! All orders for the new i.MX25 Development kit placed at our stand during the exhibition are subject to a 15% exhibition discount.