30-jún-2011 New COM with C6-Integra DSP+ARM processors from TI We launched another turn-key development project of a Computer On Module with our Austrian partner KDS. The new COM will... Čítať ďalej
17-máj-2011 i.MX25 SODIMM Module - WinCE 6.0 BSP release Voipac released the beta version of the Board Support Package for Microsoft Windows Embedded CE 6.0 for the i.MX25 SODIM... Čítať ďalej
24-feb-2011 i.MX51 Computer On Module for just 119,- EUR Visit the Embedded World exhibition in Nuremberg in March 1 - 3, 2011 and meet us at the stand No. 625 in Hall 9. Togeth... Čítať ďalej
04-feb-2011 i.MX25 SODIMM Module running Android 2.3 Gingerbread The latest Android 2.3 Gingerbread is now available for the i.MX25 SODIMM Module in the MAXimum configuration. Please vi... Čítať ďalej
11-jan-2011 New distributor for Japan Positive One Corporation has just become our new distributor for the Japan market. Customers from the region can now ord... Čítať ďalej
04-okt-2010 Meet Voipac at MIDEST Paris exhibition in November 2 - 5, 2010 Visit the MIDEST exhibition in Paris and meet us at the stand no. 6 W 083 to explore the new i.MX25 SODIMM Module benefi... Čítať ďalej
04-okt-2010 Meet Voipac at VIENNA-TEC exhibition in October 12 - 15, 2010 Do not miss the opportunity to visit the VIENNA-TEC, meet us at the stand No. C 0124, and be among the first customers t... Čítať ďalej
16-feb-2010 i.MX25 DIMM Module at the Embedded World exhibition Visit the Embedded World exhibition in Nuremberg in March 2 - 4, 2010, to see the new i.MX25 SODIMM Module right at the ... Čítať ďalej
05-jan-2010 i.MX51 SODIMM Module with microSD socket Voipac has recently launched new i.MX51 processor based COM project. The new SODIMM sized 200-pin module will be availab... Čítať ďalej
13-nov-2009 PXA255 based products EOL The Voipac PXA255 based product line is being terminated, due to the: • PXA255 processor discontinuation by the Marvell... Čítať ďalej