Home
Voipac - The Embedded Professionals
PRODUCTS

i.MX53 SODIMM Module - PROfessional configuration

IMPORTANT NOTE:
Voipac provides complete printed schematic of the i.MX53 SODIMM Module and 1-month free technical support to every complete development kit.


The highly integrated i.MX53 SODIMM Module is the third member of growing family of VOIPAC cross compatible COMs (Computers On Module) that are specially designed for use in the same peripheral-rich i.MX25 Base Board, allowing the newly designed system to be tuned for price and performance, and re-use of the gathered knowledge as well as source code.

The used 0.8 / 1.0 / 1.2 GHz ARM CortexTM-A8 core CPUs are optimized for performance and power to meet requirements of today’s high-end devices, what makes the module ideal choice for broad range of applications in consumer, automotive, medical and industrial markets.

The core component of the system is a high-performance Freescale’s i.MX53 advanced multimedia processor with integrated display controller, full HD capability, enhanced graphics and connectivity features, and very low power consumption. The module consists of 1mm thick 10-layer HDI micro-via PCB board carrying CPU + NAND Flash + DDR3 SDRAM + Ethernet and provides all of the must-have peripherals of a standard embedded system.

The i.MX53 SODIMM Module from Voipac further integrates:
- I2C EEPROM + SPI FLASH + microSD socket bootable devices
- 3D accelerometer
- SMSP power supply for user applications
- configurable I/O voltage (1.8V / 3.3V, currently only 3.3V version available)

The i.MX53 SODIMM Module includes all of the technologically and development demanding parts, saving many man-months of high-frequency PCB design, complex prototyping, debugging and OS porting, thus minimizing the time-to-market of the customers’ own projects. The module can be plugged into a standard 200pin SODIMM socket which allows base board components to be placed even below the module.

It is manufactured in three standard configurations, however, the module configuration can be customized and tailored based on the customer needs with no additional surcharge (MQO: 10+ pcs).
For batches exceeding 100pcs, Voipac provides free service of the customer's own boot loader preloading prior to the order dispatch.
For outdoor applications, i.MX53 SODIMM Module is available also in industrial temperature range.

The key processor features:
High-Speed USB 2.0 OTG
High-Speed USB 2.0 Host
LCD controller supporting UXGA 1600x1200
Dual display support
Dual camera interface
Hardware accelerated image processing
NEON SIMD media accelerator
OpenGL ES 2.0 and OpenVG 1.1 dual graphics accelerator
Vector Floating Point
3xUART/2xSDIO/I2C/SPI/EIM/GPIO
2xSSI/AC97/I2S
Keypad controller

Minimum availability
The i.MX53 CPU launched in February 2011 belongs to the group of CPUs included in the Freescale Product Longevity Program, that guarantees a minimum availability period of 15 years for the automotive and medical segments, and 10 years for all other market segments.

Flexibility of the second source
The Voipac i.MX53 SODIMM Module is compatible with the KaRo electronics TX53 module. For more details, see the i.MX53 SODIMM Module datasheet at the Downloads section.


i.MX53 SODIMM Module PRO specification:
- i.MX535 ARM CortexTM-A8 core CPU, 1.0GHz (by default set to 800MHz)
- 256MB NAND Flash
- 1GB DDR3 SDRAM
- 512Kb I2C EEPROM
- 32Mb SPI Flash
- microSD socket
- 3D accelerometer
- SMSP power supply for user applications
- 10/100 Mbps Ethernet
- 200pin SODIMM connector
- JTAG connector pads
- Power supply single 3.6V to 5.5V
- Configurable I/O voltage of 1.65 to 3.6V, set to 3.3V
- Dimensions 67.6 x 38.0mm
- Preinstalled OS Linux 2.6.35.3 with BusyBox 1.18.5 extension
- Commercial temperature range of 0°C to +70°C
- RoHS compliant


For the detailed specification, datasheets, software and more, please visit the Downloads section.
Other available configurations (MQO: 10pcs):
- CPU type: i.MX534/535/536/537
- NAND Flash: 128/256/512/1024/2048/4096MB
- DDR3 SDRAM: 128/256/512/1024/2048MB
- 10/100 Mbps Ethernet
- I2C EEPROM: 512Kb/not soldered
- SPI Flash: 32/64Mb/not soldered
- microSD socket/not soldered
- 3D accelerometer/not soldered
- SMPS power supply for user applications
- available temperature range:
       0°C to +70°C commercial temperature range
    -20°C to +70°C extended temperature range
    -40/-20°C to +85°C industrial temperature range
    (excluding microSD socket with max. extended temp. range)

Other available OS:
- Android Gingerbread 2.3.4 (preinstalled upon request, for surcharge)
- Ubuntu (under development)
- OpenWRT (under development)
- Ångström with Qt4e Demo extension including QtCreator SDK
  (preinstalled upon request, for surcharge)
- Windows Embedded Compact 7 BSP
  (preinstalled upon request, for surcharge)
- Debian 7 (preinstalled upon request, for surcharge)
Last update: January 02, 2016