i.MX53 SODIMM Module Max

The highly integrated i.MX53 SODIMM Module is the third member of the family of Voipac cross-compatible COMs that are specially designed for use in the same peripheral-rich i.MX25 SODIMM Base Board, allowing the newly designed system to be tuned for price and performance, and re-use of the gathered knowledge.
Volume price table
Quantity 1 - 9 10 - 99 100 - 999 1000+
Unit price* 149 EUR 146 EUR 136 EUR 108 EUR

* For orders exceeding 1 000 units, or customized configuration quotes, please submit your request.

Available on stock

The NXP 1.2GHz ARM CortexTM - A8 core CPU is optimized for performance and power consumption to meet requirements of high-end devices, making the module ideal choice for broad range of applications in consumer, automotive, medical and industrial markets.

The core component of the system is a high-performance NXP i.MX535 advanced multimedia processor with integrated display controller, enhanced graphics and connectivity features, full HD capability, and very low power consumption. The module consists of 1mm thin 10-layer HDI micro-via PCB board carrying CPU, NAND Flash, DDR3 SDRAM, Ethernet and provides all of the must-have peripherals of a standard embedded system.

The i.MX53 SODIMM Module Max further integrates:
• I2C EEPROM + SPI FLASH + microSD socket bootable devices
• 3D accelerometer
• SMSP power supply for user applications
• configurable I/O voltage (1.8V / 3.3V, by default set to 3.3V)

The i.MX53 SODIMM Module includes all of the technologically and development demanding parts, saving many man-months of high-frequency PCB design, complex prototyping, debugging and OS porting, thus minimizing the time-to-market of the customers’ own products. The module can be plugged into a standard 200-pin SODIMM socket which allows base board components to be placed even below the module.

• hardware accelerated image processing

• Neon SIMD media accelerator

• OpenGL ES 2.0 and OpenVG 1.1 dual graphics accelerator

• Vector Floating Point integrated

• LCD controller supporting UXGA 1600x1200

• dual display support

• dual camera interface

• High-Speed USB 2.0 OTG

• High-Speed USB 2.0 Host

• keypad controller

• 2x SSI/AC97/I2S

• 3x UART

• 2x SDIO

• I2C

• SPI

• EIM

• GPIOs

• i.MX535 ARM CortexTM - A8 core CPU, 1.2GHz (by default set to 800MHz)

• 512MB NAND Flash

• 2GB DDR3 SDRAM

• 512Kbit I2C EEPROM

• 64Mbit SPI Flash

• microSD socket

• 3D accelerometer

• SMSP power supply for user applications

• 10/100 Mbps Ethernet

• 200-pin SODIMM connector

• JTAG connector pads

• Power supply single 3.6V to 5.5V

• Configurable I/O voltage from 1.65V to 3.6V, set to 3.3V

• Dimensions 67.6 x 38.0mm

• 0°C to +70°C Commercial temperature range

• OS Linux 3.12.13 preinstalled

• Lead free, REACH / RoHS compliant

• Android 2.3.4 Gingerbread (preinstalled upon request, for surcharge)

• Ångström with Qt4e Demo extension including Qt SDK Creator (preinstalled upon request, for surcharge)

• Windows Embedded Compact 7 BSP (preinstalled upon request, for surcharge)

• Debian 7 (preinstalled upon request, for surcharge)

The i.MX53 SODIMM Module is manufactured in three standard versions, however the module configuration can be customized and tailored based on the customer needs with no additional surcharge (MOQ: 10+ pcs).

For batches exceeding 100pcs, Voipac provides free service of the customer's own boot loader preloading prior to the order dispatch.

For outdoor applications, i.MX53 SODIMM Module is available also in -20°C to +70°C Extended temperature range or in -40/-20°C to +85°C Industrial temperature range (excluding microSD socket, which is available in -20°C to +70°C range max).

The i.MX53 CPU belongs to the group of CPUs included in the NXP Product Longevity Program, that guarantees a minimum availability period of 15 years for the automotive and medical segments, and 10 years for all other market segments.

This product is supported by standard end-of-life Voipac notification policy.