Meet us at the ELO SYS exhibition in Trencin

Visit our booth No. 131 at the Expo Center's pavilion No. 10 in October 14 - 17, 2008 to find out more about the Embedded System solutions developed by Voipac. Besides the new MAXimum configuration and the market's smallest form factor PXA270 DIMM Module, the new prototype of the cost-optimized version of the PXA270 DIMM Module with increased FLASH memory capacity - the PXA270”M” DIMM Module will be presented. Together with attractive products based on the Voipac modular solutions, the new USB JTAG cable with serial line supporting various voltages will be introduced as well. All orders for development kits placed during the exhibition at our booth are subject to a 15% exhibition discount!