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Voipac at the Embedded World 2024 Conference

Voipac is very excited to announce its participation at the upcoming Embedded World 2024 Conference in Nuremberg. This world-leading exposition reaching global audience in multiple international locations, delivers the latest trends and technical innovations in the field of embedded systems. All of the most recent Voipac COMs will be presented, such as the rugged and accessory-rich iMX8M Industrial Module or the well-supported iMX6 TinyRex and Rex Modules with over a decade availability period still ahead.

Besides the line of existing development kits and other special deals, Voipac will introduce the next generation of cost-optimized and energy-efficient Computer On Module with a rich set of peripherals targeting automotive, consumer and industrial IoT market segments. More details will be presented shortly!