23-Aug-2007 Release of the Opie GUI Graphical User Environment OPIE (Open Palmtop Integrated Environment) is now available for the PXA270 DIMM Module runnin... Read more
22-Jun-2007 Release of BSP for WinCE 6.0 Voipac released the beta version of the Board Support Package for Microsoft Windows Embedded CE 6.0 running on the PXA27... Read more
30-Apr-2007 Electrosalon exhibition in Budapest Meet us at the ELECTROSALON in Budapest in May 8 - 11, 2007, an exhibition for the electronic and electrotechnical branc... Read more
12-Apr-2007 EnterEX exhibition in Kiev Meet us at the EnterEX, the largest international trade show of corporate information systems in Ukraine. Visit the boot... Read more
09-Mar-2007 Amper exhibition in Prague Voipac, together with other foremost companies from the region, was invited to take part as a co-exhibitor at the road s... Read more
05-Mar-2007 Microsoft OEM Technical Seminars in Prague Voipac was invited to present its PXA270 hardware development platform for the new WinCE 6.0 OS at the Microsoft Roadsho... Read more
02-Mar-2007 Voipac joined the Windows Embedded Partner Program To provide our customers with even more comfortable way of using our modular solutions with the WinCE 6.0 OS, we decided... Read more
05-Jan-2007 PXA270 EMBEDDED PC Development Kit - official sales launch Meet us in February at the Microsoft Embedded Seminars in Prague or Bratislava and take part at the official sales launc... Read more
01-Jan-2007 Attractive pricing of Voipac boards To make products based on Voipac boards even more competitive, we have again cut our prices! Please see the new pricelis... Read more
22-Sep-2006 PXA270 Development Kit introduction Voipac has finished working prototype of the PXA270 Development Kit. The public introduction will take place at our boot... Read more